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DATA SHEET
SKY77318 iPACTM PAM for Quad-Band GSM / GPRS
Applications
* Quad-Band cellular handsets encompassing - Class 4 GSM850/900 - Class 1 DCS1800/ PCS1900 - Class 12 GPRS multi-slot operation
Description
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pads to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and output ports of the SKY77318 are internally matched to a 50 load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 A, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 1 below, the BS pad selects the PA output (DCS/PCS_OUT or GSM_OUT) and the Analog Power Control (VAPC) controls the level of output power. The VBATT pad connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPACTM) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
Features
* Low input power range - 0 to 6 dBm * High efficiency - CELL 58% - GSM 56% - DCS 56% - PCS 56% * BiCMOS PA controller and interface IC - Low power control slope - Fast response time - Improved control accuracy * Integrated closed loop power amplifier control * Internal ICC sense resistor for PAC * Input/Output matching 50 internal (with DC blocking) * 20-pad package * Small outline: 6 x 6 mm * Low profile: 1.2 mm * MSL3/260 C
VCC1 GSM_IN Match HBT
MODULE
VBATT POWER CONTROL VAPC ENABLE BAND SELECT DCS/PCS_IN GND
BiCMOS Integrated Power Amplifier Controller
PA
Match
GSM_OUT
PA Match
Match
DCS/PCS_OUT
200242_001
Figure 1. Functional Block Diagram
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Electrical Specifications
The following tables list the electrical characteristics of the SKY77318 Power Amplifier Module. Table 1 lists the absolute maximum ratings and Table 2 shows the recommended operating conditions. Table 3 lists the electrical characteristics of the SKY77318 for modes GSM, DCS1800, and PCS1900. Figure 2 is a diagram of a typical SKY77318 application. The SKY77318 is a static-sensitive electronic device and should not be stored or operated near strong electrostatic fields. Detailed information on device dimensions, pad descriptions, packaging and handling can be found in later sections of this data sheet.
Table 1. Absolute Maximum Ratings
Parameter Input Power (PIN) Supply Voltage (VCC), Standby, VAPC 0.3 V, ENABLE 0.2 V Control Voltage (VAPC) Storage Temperature Minimum -- -- -0.5 -55 Maximum 15 7 VCC_MAX - 0.2 (See Table 3) +150 Unit dBm V V C
Table 2. Recommended Operating Conditions
Parameter Supply Voltage (VCC) Supply Current (ICC) Operating Case Temperature (TCASE) - Package Bottom Surface 1-Slot (12.5% duty cycle) 2-Slot (25.0% duty cycle) 3-Slot (37.5% duty cycle) 4-Slot (50.0% duty cycle) -20 -20 -20 -20 -- -- -- -- +100 +100 +85 +85 C Minimum 2.9 0 Typical 3.5 -- Maximum 4.8 2.5 Unit V A
Table 3. SKY77318 Electrical Specifications (1 of 9)
General Parameter Supply voltage Power control impedance ENABLE control voltage ENABLE current Band Select control voltage Band Select current Low High Low High VCC ZAPC VPE VPE IPE VBS VBS IBS VBS 3.0 V VCC 4.5 V VAPC = 0.1 V ENABLE 0.2 V TCASE = +25 C PIN -60 dBm -- -- VPE 3.0 V -- -- Symbol Test Condition -- -- -- -- Minimum 2.9 -- -0.1 1.2 -- -0.1 1.2 -- Typical 3.5 200 -- -- -- -- -- -- Maximum 4.8 -- 0.6 Vcc 30 0.6 Vcc 30 A A V Units V k V
Standby Mode Leakage current
IQ
--
2.5
10
A
VAPC Input Filter Bandwidth VAPC Threshold
VAPC _FBW VAPC _THCL
85 100
120 150
150 200
kHz mV
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Table 3. SKY77318 Electrical Specifications 1 (2 of 9)
GSM850 Mode (f = 824 to 849 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage f PIN VAPC Symbol Test Condition -- -- -- VCC = 3.5 V POUT = 34.75 dBm ENABLE > 2.0 V pulse width 577 s duty cycle 1:8 TCASE = +25 C BW = 3 MHz 6.5 dBm Pout 34.75 dBm VCC = 3.5 V TCASE = +25 C VCC = 2.9 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm VCC = 4.5 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm POUT = 6.5 to 34.75 dBm, controlled by VAPC PIN = 6 dBm VAPC = 0.1 V ENABLE 0.2 V All combinations of the following parameters: VAPC = controlled 2 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 8:1, all phase angles Minimum 824 0 0.2 Typical -- -- -- Maximum 849 6 1.7 Units MHz dBm V
Power Added Efficiency
PAE
50
58
--
%
2nd to 13th harmonics
2f0 to 13f0 POUT_MAX
-- 34.75
-- 35.2
-10 --
dBm
POUT_MAX LOW VOLTAGE Output power
32.5
--
-- dBm
POUT_MAX HIGH VOLTAGE
32.5
--
--
Input VSWR
IN
--
1.5:1
2.5:1
--
Forward isolation
POUT_STANDBY
--
--
-35
dBm
Spurious
Spur
No parasitic oscillation > -36 dBm
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Table 3. SKY77318 Electrical Specifications 1 (3 of 9)
GSM850 Mode (f = 824 to 849 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VAPC = controlled 2 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 10:1, all phase angles At f0 + 20 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C At fO + 10 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C At 1805 to 1880 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C Coupling of Fundamental, 2nd, and 3rd harmonics from the GSM band into the DCS/PCS band Power control dynamic range Power control variation 4 (Control level 5-15) 3.2 VCC 4.5 PCV Power control variation 4 (Control level 16-19) Power control slope PCS f0 2fO 3f0 PCDR Measured at the DCS/PCS output, -15 dBm POUT 34.75 dBm VCC = 3.5 V TCASE = +25 C -- POUT = 14.5 to +34.75 dBm, +25 C POUT = 14.5 to +34.75 dBm POUT = 6.5 to +12.5 dBm, +25 C POUT = 6.5 to +12.5 dBm 6.5 to 34.75 dBm Minimum Typical Maximum Units
Load mismatch
Load
No module damage or permanent degradation
--
--
-81
Noise power
PNOISE
--
--
-76
dBm
--
--
-84
-- -- -- 30 -0.8 -1.3 -1.1 -1.7 --
-- -- -- 50 -- -- -- -- --
3 -14 -17 -- 0.8 1.3 1.1 1.7 150 dB/V dB dB dBm
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Table 3. SKY77318 Electrical Specifications 1 (4 of 9)
GSM900 Mode (f = 880 to 915 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage f PIN VAPC Symbol Test Condition -- -- -- VCC = 3.5 V POUT = 34.5 dBm ENABLE > 2.0 V pulse width 577 s duty cycle 1:8 TCASE = +25 C BW = 3 MHz 6.5 dBm POUT 34.5 dBm TCASE = +25 C VCC = 3.5 V TCASE = +25 C VCC = 2.9 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm VCC = 4.5 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm POUT = 6.5 to 34.5 dBm, controlled by VAPC PIN = 6 dBm VAPC = 0.1 V ENABLE 0.2 V All combinations of the following parameters: VAPC = controlled 2 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 8:1, all phase angles Minimum 880 0 0.2 Typical -- -- -- Maximum 915 6 1.7 Units MHz dBm V
Power Added Efficiency
PAE
48
56
--
%
2f0 to 13f0 2nd to 13th harmonics 7F0 POUT_MAX
-- -- 34.5
-- -- 35.2
-10 dBm -5 --
POUT_MAX LOW VOLTAGE Output power
32.5
--
-- dBm
POUT_MAX HIGH VOLTAGE
32.5
--
--
Input VSWR
IN
--
1.5:1
2.5:1
--
Forward isolation
POUT_STANDBY
--
--
-35
dBm
Spurious
Spur
No parasitic oscillation > -36 dBm
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Table 3. SKY77318 Electrical Specifications 1 (5 of 9)
GSM900 Mode (f = 880 to 915 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VAPC = controlled 2 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 10:1, all phase angles At f0 + 20 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C At f0 + 10 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C At 1805 to 1880 MHz RBW = 100 kHz VCC = 3.5 V 6.5 dBm POUT 34.75 dBm TCASE = +25 C Coupling of Fundamental, 2nd, and 3rd harmonics from the GSM band into the DCS/PCS band Power control dynamic range Power control variation 4 (Control level 5-15) 3.2 VCC 4.5 PCV Power control variation 4 (Control level 16-19) Power control slope PCS f0 2fO 3f0 PCDR Measured at the DCS/PCS output, -15 dBm POUT 34.75 dBm VCC = 3.5 V TCASE = +25 C -- POUT = 14.5 to +34.75 dBm, +25 C POUT = 14.5 to +34.75 dBm POUT = 6.5 to +12.5 dBm, +25 C POUT = 6.5 to +12.5 dBm 6.5 to 34.75 dBm Minimum Typical Maximum Units
Load mismatch
Load
No module damage or permanent degradation
--
--
-81
Noise power
PNOISE
--
--
-76
dBm
--
--
-84
-- -- -- 30 -0.8 -1.3 -1.1 -1.7 --
-- -- -- 50 -- -- -- -- --
3 -16 -17 -- 0.8 1.3 1.1 1.7 150 dB/V dB dB dBm
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Table 3. SKY77318 Electrical Specifications 1 (6 of 9)
DCS1800 Mode (f = 1710 to 1785 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage f PIN VAPC Symbol Test Condition -- -- -- VCC = 3.5 V POUT = 32.8 dBm ENABLE > 2.0 V pulse width 577 s duty cycle 1:8 TCASE = +25 C BW = 3 MHz 1.5 dBm POUT 32.8 dBm VCC = 3.5 V TCASE = +25 C VCC = 3.5 V TCASE = +25 C VCC = 2.9 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm VCC = 4.5 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm POUT = 1.5 to 32.8 dBm, controlled by VAPC PIN = 6 dBm VAPC = 0.1 V ENABLE 0.2 V All combinations of the following parameters: VAPC = controlled 3 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 8:1, all phase angles Minimum 1710 0 0.2 Typical -- -- -- Maximum 1785 6 1.7 Units MHz dBm V
Power Added Efficiency
PAE
48
52
--
%
2nd to 7th harmonics
2f0 to 7f0
--
--
-10
dBm
POUT_MAX
32.8
33.5
--
POUT_MAX LOW VOLTAGE Output power
30.0
--
-- dBm
POUT_MAX HIGH
VOLTAGE
30.0
--
--
Input VSWR
IN
--
1.5:1
2.5:1
--
Forward isolation
POUT_STANDBY
--
--
-35
dBm
Spurious
Spur
No parasitic oscillation > -36 dBm
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Table 3. SKY77318 Electrical Specifications 1 (7 of 9)
DCS1800 Mode (f = 1710 to 1785 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VAPC = controlled 3 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 10:1, all phase angles At f0 + 20 MHz RBW = 100 kHz VCC = 3.5 V 1.5 dBm POUT 32.8 dBm TCASE = +25 C At 925 to 960 MHz RBW = 100 kHz VCC = 3.5 V 1.5 dBm POUT 32.8 dBm TCASE = +25 C Power control dynamic range Power control variation 4 (Control level 0-8) 3.2 V VCC 4.5 V Power control variation 4 (Control level 9-13) Power control variation 4 (Control level 14-15) Power control slope PCS PCV PCDR -- POUT = 15.5 to +32.8 dBm, +25 C POUT = 15.5 to +32.8 dBm POUT = 5.5 to +13.5 dBm, +25 C POUT = 5.5 to +13.5 dBm POUT = 1.5 to +3.5 dBm, +25 C POUT = 1.5 to +3.5 dBm 1.5 to 32.8 dBm Minimum Typical Maximum Units
Load mismatch
Load
No module damage or permanent degradation
--
--
-78 dBm
Noise power
PNOISE
--
--
-87
35 -1.1 -2.0 -1.1 -3.4 -1.4 -4.0 --
50 -- -- -- -- -- -- --
-- 1.1 1.2 1.1 1.4 0.8 2.0 150
dB
dB
dB/V
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Table 3. SKY77318 Electrical Specifications 1 (8 of 9)
PCS1900 Mode (f = 1850 to 1910 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage F PIN VAPC Symbol Test Condition -- -- -- VCC = 3.5 V POUT = 32.8 dBm ENABLE > 2.0 V pulse width 577 s duty cycle 1:8 TCASE = +25 C BW = 3 MHz 1.5 dBm POUT 32.8 dBm VCC = 3.5 V TCASE = +25 C VCC = 3.5 V TCASE = +25 C VCC = 2.9 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm VCC = 4.5 V ENABLE > 2.0 V TCASE = -20 C to +100 C (See Table 2 for multi-slot.) PIN = 0 dBm POUT = 1.5 to 32.8 dBm, controlled by VAPC PIN = 6 dBm VAPC = 0.1 V ENABLE 0.2 V All combinations of the following parameters: VAPC = controlled 3 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 8:1, phase angles Minimum 1850 0 0.2 Typical -- -- Maximum 1910 6 1.7 Units MHz dBm V
Power Added Efficiency
PAE
48
52
--
%
2f0 to 7f0 2nd to 7th harmonics 5f0 POUT_MAX
-- -- 32.8
-- -- 33.5
-10 dBm -7 --
POUT_MAX LOW VOLTAGE Output power
30.0
--
-- dBm
POUT_MAX HIGH VOLTAGE
30.0
--
--
Input VSWR
IN
--
1.5:1
2.5:1
--
Forward isolation
POUT_STANDBY
--
--
-35
dBm
Spurious
Spur
No parasitic oscillation > -36 dBm
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Table 3. SKY77318 Electrical Specifications 1 (9 of 9)
PCS1900 Mode (f = 1850 to 1910 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VAPC = controlled 3 PIN = min. to max. VCC = 2.9 V to 4.8 V Load VSWR = 10:1, all phase angles At f0 + 20 MHz RBW = 100 kHz VCC = 3.5 V 1.5 dBm POUT 32.8 dBm TCASE = +25 C At 880 to 915 MHz RBW = 100 kHz VCC = 3.5 V 1.5 dBm POUT 32.8 dBm TCASE = +25 C Power control dynamic range Power control variation 4 (Control level 0-8) 3.2 V VCC 4.5 V Power control variation 4 (Control level 9-13) Power control variation 4 (Control level 14-15) Power control slope
1
Minimum
Typical
Maximum
Units
Load mismatch
Load
No module damage or permanent degradation
--
--
-78 dBm
Noise power
PNOISE
--
--
-87
PCDR PCV
-- POUT = 15.5 to +32.8 dBm, +25 C POUT = 15.5 to +32.8 dBm
35 -1.1 -2.0 -1.1 -3.4 -1.4 -4.0 --
50 -- -- -- -- -- -- --
-- 1.1 1.2 1.1 1.4 0.8 2.0 150
dB dB
PCV
POUT = 5.5 to +13.5 dBm, +25 C POUT = 5.5 to +13.5 dBm
dB
PCV PCS
POUT = 1.5 to +3.5 dBm, +25 C POUT = 1.5 to +3.5 dBm 1.5 to 32.8 dBm
dB dB/V
Unless specified otherwise: TCASE = -20 C to max. operating temperature (see Table 2) RL = 50 pulsed operation with pulse width 1154 s and duty cycle 2:8 VCC = 2.9 V to 4.8 V. ICC = 0A to xA, where x = current at POUT = 34.75 dBm for Cell and 34.5 dBm for GSM, 50 load, and VCC = 3.5 V. ICC = 0A to xA, where x = current at POUT = 32.8 dBm, 50 load, and VCC = 3.5 V. Power control variation is measured by comparing power obtained at a specified control voltage over all conditions, against the power obtained with the same control voltage at nominal conditions. For this module, nominal conditions are defined as: T = 25 C VCC = 3.5 V PIN = 3 dBm Frequency = mid-band
2 3 4
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Place 0402 and 33 F caps as close as possible to the VBATT pin with the 0402 closer to the pin. From Battery GND 0.01F 0402 16 DCS/PCS_OUT 15 GND 14 GND 13 GND 12 GSM_OUT 11
VBATT 17 ENABLE 10 GND
33 F
18 9
GND
RSVD (GND)
SKY77318
19 8 GND
VAPC
20
7
GND
VCC1A DC Supply trace to VCC1 must not be routed via VBATT pin 17. 1 BS 0402 0.01F 2 3 DCS/PCS_IN 4 GSM_IN 5 GND 0402 0.01F 6 VCC1B
NOTES: 1. The value of 33 F cap depends on the noise level on the phone board. 2. Depending on phone board noise level, not all 0402 and 0.01 F caps may be needed. 3. Ensure sufficient numbers of vias connect VBATT pin to battery trace. 4. VBATT trace should be 1.0 mm. 5. Ensure sufficient numbers of vias connect VCC1A and B to battery trace. 6. VCC1A and VCC1B trace widths should be 0.25 mm. 7. Ground terminals of all bypass caps are connected to ground plane with vias. 8. Dotted traces can be routed in the inner layers.
Figure 2. Typical SKY77318 PAM Application
200424_002
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Package Dimensions and Pad Description
Figure 3 is a mechanical diagram of the pad layout for the SKY77318, a 20-pad leadess Quad-Band PA module. Figure 4 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50 ohm terminals. Figure 5 shows the device pad configuration and Table 4 lists the pad names and signal descriptions. The pad numbering convention starts with pad 1 at the upper left, as indicated in Figure 5, and increments counter-clockwise around the package. Figure 6 interprets typical case markings.
6 PIN 1 LOCATOR
B C
0.5 0.1
(0.1) 6
0.5 0.05 METAL PAD EDGE
DETAIL PAD SCALE: 2X
A
6X THIS ROTATION 6X ROTATED 180 4X ROTATED 90 CW 4X ROTATED 90 CCW
0.15 A B C
TOP VIEW
4X 1.5 4X 0.5
12X 2.9
0
PIN 20 METAL PAD PIN 1 INDICATOR
4X 2.5 4X 1.5 4X 0.5 0
A
2X 1.9 8X 2.9 A
2X 1.9
20X SMT PAD 0.15 A B C
1.15 0.1 0.1
4X R0.2
SOLDER MASK OPENING 0.2 A B C
SIDE VIEW
NOTES: UNLESS OTHERWISE SPECIFIED.
1. DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. PADS ARE SOLDER MASK DEFINED ON ALL THREE EDGES AND METAL DEFINED ON ONE EDGE.
BOTTOM VIEW
103237_003
Figure 3. SKY77318 PAM Package Dimensions--20-Pad Leadless (All Views)
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SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
6.3 20X 0.75 PIN 1 PIN 20
20X 0.5
0.5 1 TYP
Stencil aperture size for Center Ground Pad should be 60% to 80% (by area) of the solder mask opening.
0.5
Package Outline
STENCIL APERTURE
TOP VIEW
6.3 (Merged ground pads 9X) 20X 0.85 PIN 1 PIN 20 0.25 PIN 20 PIN 1 4X R0.2 6.4 3.8
20X 0.6
0.16 0.5 1 TYP 0.6 20X 0.5 Thermal Via Array under PA areas. O0.3 mm on 0.6 mm pitch. Additional vias will improve thermal performance. NOTE: Thermal vias should be tented and filled with solder mask; 30-35 m Cu plating is recommended. Exposed Center Pad Package Outline TOP VIEW 0.5 1 TYP 3.8
20X 0.75 Package Outline 0.6 0.12
0.45
SOLDER MASK OPENING
METALLIZATION
TOP VIEW
The shaded area represents the merger of the Center Ground Pad and 9 individual I/O ground pads. The outlines of these pads are shown for reference.
ALL DIMENSIONS ARE IN MILLIMETERS.
200424_004
Figure 4. Phone Board Layout Footprint for 6 x 6 mm, 20-Pad Package - SKY77318
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DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Figure 5. SKY77318 PAM Pad Configuration--20-Pad Leadless (Top View)
Figure 6. Typical Case Markings
Table 4. SKY77318 Pad Names and Signal Descriptions
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 GND PAD BS VCC1A DCS/PCS_IN GSM_IN GND VCC1B GND GND GND GND GSM_OUT GND GND GND DCS/PCS_OUT GND VBATT ENABLE RSVD(GND) VAPC GND Name Band Select VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC) RF input 1710-1910 MHz (DCS1800, PCS1900) RF input 880-915 MHz (GSM) RF and DC Ground VCC (to GSM 2nd stage, DCS/PCS 2nd stages) RF and DC Ground RF and DC Ground RF and DC Ground RF and DC Ground RF Output 880-915 MHz (GSM) RF and DC Ground RF and DC Ground RF and DC Ground RF Output 1710-1910 MHz (DCS1800, PCS1900) RF and DC Ground Battery input to high side of internal sense resistor BiCMOS Enable RF and DC Ground Power Control Bias Voltage Ground Pad, device underside Description
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 14
December 17, 2007 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200424B
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77318 is capable of withstanding an MSL3/260 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 260 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel - RF Modules, Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77318 has been classified as a Human Body Model Class 1C (1000 volts to < 2000 volts) and Machine Model Class M2 (100 volts to < 200 volts) device. ESD testing has been performed in compliance to the latest JEDEC Human Body Model specification, HBM (JESD22-A114-B) and Machine Model specification, (JESD22-A115-A). A report summarizing the ESD testing, including ESD failure level thresholds on each pad-toground and pad-to-pad combination, may be obtained upon request. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed below.
* Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200424B * Skyworks Proprietary and Confidential Information * Products and product information are subject to change without notice. * December 17, 2007
15
DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Technical Information
Closed loop control of the amplifier is enabled when ENABLE is driven to logic high. The PA collector current will then be directly proportional to the VAPC input voltage over the range of 200 mV to 2.1 V. To meet the GSM power versus time mask and switching transient requirements the PAM must be provided with a DAC ramp profile on the VAPC input as well as proper timing on digital controls for the PAC circuitry. Note: Please refer to 3GPP TS 51.010-1: Mobile Station (MS) conformance specification. All GSM specifications are now the responsibility of 3GPP. The standards are available at http://www.3GPP.org. acceptable spectral limits at specified offset frequencies. The VAPC input has an internal reconstruction filter such that external resistors or capacitors are unnecessary on the phone board or the test fixture. Figure 7 represents the dynamic characteristics of the RF output burst power that results from the ramp profile delivered by the DAC to the VAPC input. The transmit power must not exceed the given limits at the time specified relative to the start and end of the data burst. Additional requirements are placed on spectral components generated by switching transients. Ramping at high rates will result in components that violate these spectral limits. A ramp control signal must be applied to the VAPC pad, which results in the desired power ramp response. The log relationship of VAPC to POUT, along with the finite bandwidth and potential slew rate limitations of the feedback loop, results in a complex mapping of the ramp profile to the actual output power. Careful attention is required in generating the input waveform which results in the desired output response. Figure 8 shows an example of the Skyworks PAM test setup for evaluation of RF performance with various ramp profiles. The user's test setup may also include a TX/RX switch and a diplexer in the output signal path. Alternatively, the SKY77318 PAM may be installed in a phone board.
The SKY77318 has been designed to comply with interface requirements and DAC resolution of leading base band devices. The ramp profile typically consists of a pedestal voltage, 10 to 16 discrete voltage steps on the rising edge of the burst, a constant region, 10 to 16 steps on the falling edge, and a final voltage. Typically, the user defines the start, stop, and 10 to 16 percentage values for each rising and falling edge, which are then applied as discrete voltages at the VAPC input. For the SKY77318, generally the same profile, scaled in amplitude, is used for all frequencies and power control levels. The ultimate purpose is to keep the RF output power ramp within the time mask and to maintain
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 16
December 17, 2007 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200424B
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
DATA SHEET
VBATT
VCC1
BS
TX_RX
PAC_EN
17 s
Peak DAC Value
12 s
VAPC
Pedestal Period
Ramp Up Profile
Ramp Down Profile
Final Period
6 s dB
+4 +1 -1 -6 (2)
11 s
9 s
3s (Trace Exaggerated For Clarity)
(t)
Output Power
-30 (3)
Ramp Up Pedestal
Ramp Down Final Value
(1)
(t)
10 s
8 s
10 s
542.8 s Burst (147 bits)
10 s
8 s
10 s
(1) (2)
For GSM For DCS1800 / PCS1900 For GSM
-59 dBc or -36 dBm, whichever is higher. -48 dBc or -48 dBm, whichever is higher. -4 dBc for power control level 16, -2 dBc for power control level 17, -1 dBc for power control level 18 and 19. -4 dBc for power control level 11, -2 dBc for power control level 12, -1 dBc for power control level 13, 14, 15. -30 dBc or -17 dBm, whichever is higher. -30 dBc or -20 dBm, whichever is higher.
103237_008
For DCS1800 / PCS1900
(3)
For GSM For DCS1800 / PCS1900
Figure 7. Example of PAM Recommended Timing Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200424B * Skyworks Proprietary and Confidential Information * Products and product information are subject to change without notice. * December 17, 2007
17
DATA SHEET
SKY77318 iPACTM PAM FOR QUAD-BAND GSM / GPRS
Figure 8. PAM Evaluation Test Setup - BiCMOS.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 18
December 17, 2007 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200424B
Ordering Information
Model Number SKY77318 Manufacturing Part Number SKY77318 Product Revision Package 6 x 6 x 1.2 mm Operating Temperature -20 C to +100 C
Revision History
Revision A B Level Date January 31, 2007 December 17, 2007 Initial Release Revise: Table 3 (8 of 9) VAPC Description
References
Application Note: Tape and Reel Information - RF Modules, Document Number 101568 Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Brief: iPACTM GSM Transmitter Timing, Calibration and Baseband Control, Document Number 103138 Application Note: iPACTM Peak Output Power Calibration, Document Number 103180 User Guide: iPACTM Test and Control - Baseband Emulator Interface, Document Number 103125 JEDEC Standard J-STD-020 3GPP TS 51.010-1; Mobile Station (MS) Conformance Specification (http://www.3GPP.org)
(c) 2006-2007, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKSTM PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. SkyworksTM products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling SkyworksTM products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks symbol, and "Breakthrough Simplicity"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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